Robotics & Industrial Automation

Industrial Computer Enclosure: Dust and Vibration Control

The enclosure protected a factory-floor industrial computer from dust and mechanical vibration.

Anonymous Customer Case Study

📅 July 2, 2026 ⏱ 2 min read 🏭 DRAmetal Engineering
Industrial Computer Enclosure: Dust and Vibration Control — component reference
Component reference image
5 g, 10–500 Hz Vibration test
IP5X Dust protection
0–55°C Operating temperature
Mini-ITX Board format

Project Overview

Application The enclosure protected a factory-floor industrial computer from dust and mechanical vibration.
Materials 2.0 mm aluminum; 1.0 mm steel.
Process Route Laser cutting → bending → welding → powder coating → cooling assembly → vibration testing.
Customer Challenge Dust and vibration caused shutdowns, damaged storage devices and loosened connectors.

The enclosure protected a factory-floor industrial computer from dust and mechanical vibration.

The customer’s challenge

Dust and vibration caused shutdowns, damaged storage devices and loosened connectors.

Material and fabrication route

2.0 mm aluminum; 1.0 mm steel.

Process route: Laser cutting → bending → welding → powder coating → cooling assembly → vibration testing.

Manufacturing changes

The design provided conduction-cooling or filtered-air arrangements, isolated drive mounts and locking connectors matched to the required configuration.

Engineering analysis

The computer enclosure needed to protect connectors and storage devices while maintaining cooling. The project combined a configuration-appropriate cooling route with isolation and retained connections. Dust protection and vibration behavior were checked on the assembled computer configuration. For an OEM buyer, the board format, drive mounting and connector interfaces are therefore essential RFQ inputs, not details that can be left until after the enclosure is manufactured.

Inspection and project results

The tested computer configuration passed the reported 5 g vibration check and achieved IP5X protection without the previous operating interruptions.

Project measurement or production detailRecorded value
Vibration test5 g, 10–500 Hz
Dust protectionIP5X
Operating temperature0–55°C
Board formatMini-ITX

These figures describe the project configuration and production scope above. Dimensional, material and production details are identified separately from performance tests. For a new order, the inspection method and acceptance criteria should be agreed against the released drawings.

Planning a similar OEM component

A useful RFQ for this application should make the following interfaces and acceptance requirements clear:

  • Board and drive arrangement.
  • Connector retention and access.
  • Dust and vibration exposure.
  • Cooling configuration and temperature acceptance.

Include the current drawing revision, mating-component information, quantities and required delivery sequence. Identifying unresolved requirements at quotation stage helps distinguish fabrication work from the equipment-level checks that the project needs.

For related manufacturing support, review our Industrial Computer Enclosures and sheet metal quality capabilities. Use the existing quotation form below to share the drawing package for review.

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