Semiconductor Equipment

Semiconductor Parts Kits: Particle and Clean-Packing Control

The kits supplied mechanical components for wafer-transfer equipment with strict particle and contamination requirements.

Anonymous Customer Case Study

📅 July 6, 2026 ⏱ 2 min read 🏭 DRAmetal Engineering
Semiconductor Parts Kits: Particle and Clean-Packing Control — component reference
Component reference image
≤10 per part Particles ≥0.3 μm
≤1 ppb Ion release
Class 100 Packing environment

Project Overview

Application The kits supplied mechanical components for wafer-transfer equipment with strict particle and contamination requirements.
Materials 2.0 mm 5052 aluminum; 1.0 mm 304 stainless steel.
Process Route Laser cutting → bending → deburring → chemical cleaning → clean packing → particle inspection.
Customer Challenge Particle shedding and metal-ion release from the parts threatened cleanliness in the customer's wafer-handling process.

The kits supplied mechanical components for wafer-transfer equipment with strict particle and contamination requirements.

The customer’s challenge

Particle shedding and metal-ion release from the parts threatened cleanliness in the customer’s wafer-handling process.

Material and fabrication route

2.0 mm 5052 aluminum; 1.0 mm 304 stainless steel.

Process route: Laser cutting → bending → deburring → chemical cleaning → clean packing → particle inspection.

Manufacturing changes

Dedicated ultrasonic and IPA cleaning, appropriate anodizing and cleanroom packing controlled the supplied condition.

Engineering analysis

Clean supply depended on the final condition after machining, finishing, cleaning and packing, not only on the material grade. The project coordinated these stages around the customer’s wafer-transfer process. Particle count, ion release and packing environment describe different parts of the requirement. Their acceptance methods should be specified for a repeat order so a clean-looking part is not substituted for the required measured condition.

Inspection and project results

Parts met the reported particle and ion-release limits and passed the customer’s clean-supply qualification.

Project measurement or production detailRecorded value
Particles ≥0.3 μm≤10 per part
Ion release≤1 ppb
Packing environmentClass 100

These figures describe the project configuration and production scope above. Dimensional, material and production details are identified separately from performance tests. For a new order, the inspection method and acceptance criteria should be agreed against the released drawings.

Planning a similar OEM component

A useful RFQ for this application should make the following interfaces and acceptance requirements clear:

  • Part drawings and contact zones.
  • Particle and ion-release limits.
  • Approved finish and cleaning route.
  • Packing environment and verification method.

Include the current drawing revision, mating-component information, quantities and required delivery sequence. Identifying unresolved requirements at quotation stage helps distinguish fabrication work from the equipment-level checks that the project needs.

For related manufacturing support, review our Semiconductor Sheet Metal Parts and sheet metal quality capabilities. Use the existing quotation form below to share the drawing package for review.

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