Board-Level Shielding Cans
Small stamped or formed shield cans are reviewed around solder tabs, removable lids, latch features and burr control.
Board-Level RF and EMI Shielding
Custom Sheet
Custom Sheet
Metal RF/EMI
Shields
Custom RF shielding cans, EMI shield covers, multi-cavity shield frames, clips, fingers and perforated shields for electronics, telecom and control module programs. We control thin-metal forming, burrs, lid fit, plating and tray packout.
✓ RF cans and EMI shield covers
✓ Thin-metal tabs, clips and lids
✓ Tray packout for electronics lines
RFQ program quantity
RFQ
Example Order Size
Drawing
Critical Dimensions
RFQ
Configuration Count
Plan
Inspection Scope
01 / What We Fabricate
Shielding Parts Built for Electronics Assembly
RF and EMI shields are small, but they carry tight practical requirements: burr direction, solder tabs, removable lids, latch fit, plating and clean tray packout.
Multi-Cavity Shield Frames
Partitioned shield frames can isolate RF sections, power areas and sensitive components in telecom and electronics assemblies.
Spring Contacts and Clips
EMI fingers, clips and latch details are controlled for repeatable fit, retention and conductivity.
Clean Packout for Electronics
Small shields ship in tray-based packout with SKU, revision, lot and finish separation for electronics assembly lines.
Our scope: fabricated shield cans and EMI metal parts
We manufacture the sheet metal shielding parts, tabs, perforations, lids, finish and packout. Your team defines the PCB layout, RF design target and system validation requirements.
02 / RF & EMI Shield Types
Shield Families for Telecom and Electronics OEMs
We support small shield programs where thin-metal forming, plating, removable lids and tray logistics decide whether the assembly line runs smoothly.
Cans RF Shielding Cans
Board-level shielding cans with solder tabs, removable lids, vent holes and tight formed-wall control.
- Features: tabs and lids
- Materials: tin plate / nickel silver
- QC: burr and fit checks
Multi-Cavity Multi-Cavity EMI Shields
Partitioned shielding frames and lids for radio modules, control boards and electronics housings.
- Features: partitions
- Fit: lid and latch control
- Use: RF modules
Contacts Shield Clips and Fingers
Small spring contacts, latch tabs, shield clips and grounding fingers made from thin conductive materials.
- Features: spring tabs
- Materials: beryllium copper / nickel silver
- Control: retention checks
Vented Perforated Shield Covers
Vented shielding covers and perforated EMI lids with punched patterns, formed edges and removable interfaces.
- Features: perforations
- Process: punch and form
- Use: thermal airflow
03 / Technical Capabilities
Typical RF and EMI Shield Specification
| Materials | Tin-plated steel, nickel silver, stainless steel, copper alloys, beryllium copper and thin pre-plated sheet |
|---|---|
| Processes | Blanking, piercing, punching, fine forming, shallow drawing, perforating, deburring, plating coordination and tray packout |
| Part features | Shield cans, removable lids, solder tabs, latch tabs, spring fingers, perforations, partitions and grounding clips |
| Finishes | Tin plating, nickel plating, passivation, stainless finish, protective oil and clean handling options |
| Quality controls | First article inspection, burr checks, lid fit checks, tab dimension checks, finish checks and lot traceability |
04 / Manufacturing Process
From Shield DFM to Electronics-Ready Packout
01
Shielding DFM Review
Review wall height, tabs, lid access, burr side, plating, solder edge and PCB keep-out requirements.
02
Prototype and Fit Check
Validate early samples around board clearance, latch fit, removable lid function and contact points.
03
Stamping or Forming
Blank, pierce, perforate and form thin metal shields with controlled tabs, slots and wall geometry.
04
Finish and Cleaning
Apply tin plating, nickel plating, passivation or protective handling based on conductivity and corrosion needs.
05
Inspection and Tray Packout
Inspect burrs, tabs, lid fit, dimensions, finish and lot labels before electronics-ready tray packout.
06
Production Release
Run shield families by SKU, revision and lot with controlled packaging for high-volume assembly.
05 / Why It Matters
What Makes a Shielding Program Reliable
Shielding parts are small and high-volume. Burrs, plating, lids and packaging must be controlled before they reach the electronics assembly line.
Burr Direction
Small burrs can affect solder joints, board clearance and handling, so burr side and edge control are part of release review.
Lid and Latch Fit
Removable shields need repeatable lid retention without damaging thin walls or PCB assemblies.
Conductive Finish
Tin, nickel, stainless or copper alloy choices need to match solderability, grounding and corrosion requirements.
Tray-Level Logistics
Small RF shields need clean tray packout and lot control so electronics assembly does not lose time sorting parts.
Customer Project
RF Shield Covers: Contact Pressure and Shape Control
Materials, fabrication decisions and results for an anonymous customer project.
Component reference image
The Customer Challenge
Poor contact, unwanted solder wicking and shield distortion reduced shielding performance.
Project Measurements & Details
≥60 dB at 1–6 GHzShielding effectiveness
≤50 mΩContact resistance
0.2–0.3 mmSheet thickness
Results apply to the project configuration described on the linked page.
Read the Customer Project → 07 / Why Choose Us
Why OEMs Trust DRAmetal for RF and EMI Shields
01
Electronics-aware DFM
We review shield geometry around PCB keep-outs, solder tabs, lid access and assembly handling.
02
Thin-metal forming control
Small wall heights, tabs, clips and perforations are planned around stamping and forming limits.
03
Finish and conductivity planning
Tin plate, nickel silver, stainless and copper alloys are matched to the shield's functional needs.
04
Lot and tray discipline
Small shield parts ship by SKU, revision and lot with tray packout for electronics lines.
08 / Related
Related Fabricated Products
09 / FAQ
Custom RF and EMI Shields FAQ
Can you manufacture small RF shielding cans and lids?
Yes. We can manufacture board-level RF shielding cans, removable lids, multi-cavity shield frames, clips and thin formed shielding parts to drawing.
Which materials are used for RF and EMI shields?
Tin-plated steel, nickel silver, stainless steel, copper alloys and beryllium copper are common choices depending on solderability, conductivity, corrosion and spring requirements.
Can you handle tray packaging for electronics assembly?
Yes. Small shields can ship in tray-based packout by SKU, revision, lot and finish so receiving and line-side assembly stay controlled.
Get Started
Need RF or EMI Shields
Need RF or EMI Shields
Built to Drawing?
Send your shield drawing, material, finish, burr side, quantity, packaging requirement and critical fit notes. Our engineering team will review manufacturability and quote the right production path.