Custom sheet metal heat sinks for air cooling — folded fin, stamped fin, and zipper fin in aluminum and copper. High fin density and large surface area in a small footprint, brazed or bonded to a sheet metal base, for power electronics, data centers, and LED.
We specialize in the sheet metal fin technologies — folded, stamped, and zipper fin — that pack maximum surface area into a small footprint for air-cooled thermal management.
Folded Fin Sheet metal folded in a progressive process into a continuous fin stack — more surface area and design flexibility than extruded fins, brazed or bonded to a base for high heat transfer.
Stamped Fin Fins formed through a progressive punching process, adding features with each stamp — a cost-effective, mass-producible solution for board-level and heat-pipe-through designs.
Zipper Fin Individual stamped fins folded and zipped together with interlocking features — high mechanical stability and design flexibility for forced-convection cooling, with heat-pipe and fan integration.
Assembly Complete air-cooled assemblies — fin stacks brazed or bonded to a base, with provisions for heat pipes, ducting, and fans for a full thermal solution.
A heat sink's performance comes from fin geometry, material, and bond quality. Here's what we fabricate to.
| Fin Materials | Aluminum (high conductivity, light) and copper (highest conductivity) |
|---|---|
| Fin Technologies | Folded fin, stamped fin, zipper (interlocking) fin |
| Fin Forming | Progressive stamping and folding — high fin density, thin geometries |
| Base | Sheet metal base plate within quoted scope; machined/extruded base by approved arrangement |
| Fin-to-Base Joining | Brazing, soldering, or epoxy bonding for low thermal resistance |
| Integration | Provisions for heat pipes, fans, ducting, and mounting features |
| Finishing | Anodizing (black for emissivity), chromate, or as-fabricated |
| Applications | Power electronics, data center, LED, telecom, industrial drives |
| Volume | Prototype to high-volume (stamping/folding suit mass production) |
Our core capability is sheet metal fin fabrication (folded, stamped, zipper) and fin-to-base assembly. Extruded-profile and skived heat sinks, and fully machined cold plates, are available through arrangement — tell us your thermal target and we'll recommend the right construction.
Heat sink performance depends on fin geometry and bond quality. Our sheet metal process controls both.
Review the thermal target, footprint, and airflow to select fin type, material, density, and base — sizing the surface area to the heat load.
Progressive stamping of fins from aluminum or copper coil stock — features and interlocks added with each stamp for zipper and stamped designs.
Progressive folding of sheet into continuous fin stacks for folded-fin designs — high fin density and thin fin geometry for maximum surface area.
Sheet metal base plate cut and formed within the quoted scope, with mounting features; machined or extruded bases sourced by arrangement for higher-performance designs.
Fin stack joined to the base by brazing, soldering, or epoxy bonding — the bond quality that sets the assembly's thermal resistance.
Anodize or chromate for corrosion and emissivity; dimensional and bond inspection before assembly of heat pipes or fans where specified.
Material drives thermal conductivity, weight, and cost. Here's how the two main fin materials compare. Our heat sink thermal design guide explains how thermal resistance, fin spacing and airflow inform the material and geometry requirements for an RFQ.
The standard choice — high thermal conductivity, light, and economical. The default for most air-cooled heat sinks where weight and cost matter.
The high-performance choice — roughly double aluminum's thermal conductivity, for high heat flux where every degree counts. Heavier and costlier.
Aluminum fins with copper base or embedded heat pipes — combining copper's spreading with aluminum's light, economical fins for an optimized balance.
Air cooling reaching its limit? Our liquid cooling manifolds handle higher heat loads for data centers.
A heat sink is only as good as its surface area and its bond to the heat source. Four things drive how well it cools.
More fin surface area means more heat transfer. Folded and stamped fins pack high fin density and thin geometries into a small footprint — more cooling per cubic centimeter than extrusion allows.
Heat has to cross from base to fin. A clean braze, solder, or epoxy bond minimizes that thermal resistance — a poor joint becomes the bottleneck that traps heat at the source.
Aluminum for most loads; copper where heat flux is high and every degree counts. Hybrid designs combine copper spreading with light aluminum fins for an optimized balance.
Natural vs forced convection changes fin spacing and orientation. Zipper fins suit forced convection and fan integration; open folded fins suit multi-directional airflow.
Materials, fabrication decisions and results for an anonymous customer project.
Component reference image
High thermal resistance and poor base contact derated the module, while excessive fin resistance and weight complicated the design.
Results apply to the project configuration described on the linked page.
Read the Customer Project →Folded, stamped, and zipper fin — the sheet metal technologies that pack surface area into a footprint.
Thin fin geometries and tight spacing for maximum heat transfer in a compact envelope.
Brazing, soldering, and epoxy bonding for the low thermal resistance performance depends on.
Aluminum, copper, and hybrid designs with heat pipe integration — matched to your heat flux.
Stamping and folding suit high-volume runs with consistent, repeatable fin geometry.
When air cooling hits its limit, our liquid cooling manifolds extend the same thermal partnership.
Sheet metal fin technologies: folded fin (sheet folded into a continuous stack), stamped fin (progressive punching), and zipper fin (individual stamped fins interlocked). These maximize surface area in a footprint. Extruded and skived heat sinks are available by arrangement.
Aluminum is the standard — high conductivity, light, economical — for most air-cooled heat sinks. Copper has roughly double the conductivity for high heat flux where every degree counts, but is heavier and costlier. Hybrid (copper base, aluminum fins, or heat pipes) balances both.
By brazing, soldering, or epoxy bonding, depending on the thermal and cost requirements. The bond quality sets the assembly's thermal resistance, so we match the joining method to your performance target.
Yes — we build fin assemblies with provisions for heat pipes, fans, and ducting for a complete air-cooled thermal solution. Tell us your airflow (natural or forced) and we'll design accordingly.
We fabricate sheet metal base plates within the quoted scope with mounting features. For designs needing a machined or extruded base (e.g. for higher performance or embedded heat pipes), we arrange those — tell us your thermal target and we'll recommend the construction.
When air cooling reaches its limit — as in high-density data centers — our liquid cooling manifolds handle higher heat loads. We can advise whether air or liquid cooling fits your application.
Send us your thermal target, footprint, airflow, and power dissipation. Our engineering team will review the submitted information and, where the scope is complete, provide a fin type and material recommendation, DFM review, and quote.